SE

Samsung Electronics​​‍‌‌​‌‍​‍​​‌​‌‌‌‌​‌‍​‌‍‍​‍

company active
Major customer of HPSP semiconductor equipment
Tracked:Major customer of HPSP semiconductor equipment · 2 documented connections
1
Facts
2
Connections
2
Sources
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Connection Map
Key Connections
← HPSP company
supplier
Provides critical semiconductor annealing equipment
Facts (1)
Data Freshness
Fresh Last update: 0d ago · Avg age: 2087d
Confidence Tiers: Primary Source — cross-referenced government/corporate filings Pending Review — sourced but not independently verified AI Inference — analytical hypothesis from cross-referencing
Documented Records (1)
Sourced from government databases, press reports, and corporate filings. Not yet independently verified.
Partially Corroborated Samsung Electronics filed filing with the​​‍‌‌​‌‍​‍​​‌​‌‌‌‌​‌‍​‌‍‍​‍ SEC on 2009-03-02. Accession number: N/A.
All Connections (2)
← HPSP company
supplier confirmed
Provides critical semiconductor annealing equipment
← NIST CHIPS Program Office (CPO) government agency
industry_coordination secondary since 2022
Major semiconductor manufacturer subject to CHIPS Act implementation and coordination overseen by NIST CPO
Sources (2)
2026-04-23 UNVERIFIED SEARCH_ERROR: Samsung Electronics not found in opencorporates claim_flag Processed
2009-03-02 ↗ SEC EDGAR: filing — Samsung Electronics (2009-03-02) sec_filing Processed